(Full abstracts for some of these papers can be found below.)
Wang G. and E.F. Matthys. 1996. Heat Transfer Modelling of the Planar
Flow Casting Process. To appear in Heat and Mass Transfer in Manufacturing
Technologies. Washington, DC: Hemisphere Pub.
Wang S.P., G.X. Wang, and E.F. Matthys. 1996. Substrate Melting and Resolidification
in Metal Deposition and Casting Processes. To appear in the Proceedings
of the 1997 NSF DDM Conference, Seattle, WA.
Wang G.X., V. Prasad, and E.F. Matthys. 1996. Solute distribution during
rapid solidification into an undercooled melt. To appear in Journal of
Crystal growth.
Wang G.X. and E.F. Matthys. 1996. Modeling of Non-equilibrium Surface Melting
and Resolidification for Pure Metals and Binary Alloys. To appear in Journal
of Heat Transfer.
Wang, G.X. and E.F. Matthys. 1996. On the Heat Transfer at the Interface
Between A Solidifying Metal and a Solid Substrate. In Melt-spinning, Strip
Casting, and Slab Casting, pp. 205-236, TMS Pub., Warrendale, PA.
Wang, G.X. and E.F. Matthys. 1996. Study of Interfacial Thermal Contact
During Solidification on a Substrate (II). In Proceedings of the 1996 NSF
Design and Manufacturing Conference, pp. 449-450, SME Pub., Dearborn MI.
Wang G.X. and E.F. Matthys. 1996. Experimental investigation of interfacial
thermal conductance for molten metal solidification on a substrate. Journal
of Heat Transfer, Vol. 118, No. 1, pp. 157-163.
Wang G.X. and E.F. Matthys. 1995. Modeling of Surface Melting and Resolidification
for Pure Metals and Binary Alloys : Effect of Non-equilibrium Kinetics.
In Transport phenomena in materials processing; vol. HTD- 317-2, pp. 349-359.
Wang G.X. and E.F. Matthys. 1995. Experimental investigation of interfacial
heat transfer for molten metal solidification on a substrate. In Transport
phenomena in Manufacturing and Materials Processing, Vol. HTD-306, pp.
171-179, ASME Pub.
Liu W., G.X. Wang, and E.F. Matthys. 1995. Thermal analysis and measurements
for a molten metal drop impacting on a substrate: cooling, solidification,
and heat transfer coefficient. International Journal of Heat and Mass Transfer.
vol. 38, No. 8, pp. 1387-1395.
Wang, G.X. and E.F. Matthys. 1995. Study of Interfacial Thermal Contact
During Solidification on a Substrate. In Proceedings of the 1995 NSF Design
and Manufacturing Conference, pp. 451-452, SME Pub., Dearbon MI.
Liu W., Wang G.X. and E.F. Matthys. 1994. Spallation of a Substrate by
Thermal Shock and Thermal Expansion Differential after Molten Metal Droplet
Deposition. In Thermal Processing of Materials (ed: V. Prasad et al.),
Vol. HTD-289, pp. 21-29, ASME Pub, Washington D.C.
Wang, G.X. and E.F. Matthys. 1994. Interfacial Thermal Contact during Rapid
Solidification on a Substrate. In Heat Transfer 1994 (ed: G. Hewitt), IChemE
Pub., Rugby UK, Vol. 4, pp. 169-174 (1994).
Wang G. and E.F. Matthys. 1993. Modeling of rapid planar solidification
of a binary alloy. In Heat and Mass Transfer in Materials Processing and
Manufacturing, Vol. HTD-261, pp. 35-44, ASME Pub.
Liu W., G. Wang, and E.F. Matthys. 1992. Determination of the thermal contact
coefficient for a molten metal droplet impinging on a substrate. In Transport
Phenomena in Materials Processing and Manufacturing, vol. HTD-196, pp.
111-118, ASME, New York.
Wang G. and E.F. Matthys. 1992. Two-dimensional boundary-layer modeling
of Planar Flow Melt-Spinning with Undercooling. In Melt-Spinning and Strip
Casting, pp. 263-282, Warrendale, PA: TMS Pub.
Matthys E.F. 1992. Heat transfer and fluid mechanics in materials processing.
In Proceedings of the 1992 NSF Design and Manufacturing System Conference,
Atlanta, January 8-10; Pub: Society of Manufacturing Engineers, Dearborn;
pp. 135-138.
G. Trapaga, E.F. Matthys, J. Valencia, and J. Szekely. 1992. Fluid Flow,
Heat Transfer, and Solidification of Molten Metal Droplets Impinging on
Substrates: Comparison of Numerical and Experimental Results. Metallurgical
Transactions, vol. 23B, No. 6, pp. 701-718.
Wang G. and E.F. Matthys. 1992. An improved boundary-layer model for the
Planar Flow Melt-spinning process. Advanced Sensing, Modelling, and Control
of Materials Processing; pp. 231-252. Warrendale, PA: TMS Pub.
Wilde P. and E.F. Matthys. 1992. Experimental Investigation of the Planar
Flow Casting Process: Development and Free Surface Characteristics of the
Solidification Puddle. Materials Science and Engineering, vol. 150, No.
2, pp. 237-247.
Wang G. and E.F. Matthys. 1992. Numerical modelling of phase change and
heat transfer during rapid solidification processes: use of control volume
integrals with element subdivision. International Journal of Heat and Mass
Transfer, 35, No. 1, pp. 141-153.
Wang G. and E.F. Matthys. 1992. Modelling of splat cooling: effect of heat
transfer and undercooling on solidification characteristics. "Advanced
Sensing, Modelling, and Control of Materials Processing"; pp. 59-80.
Warrendale, PA: TMS Pub.
Wang G. and E.F. Matthys. 1991. Heat Transfer Modelling of Rapid Solidification
on a Substrate : A Parametric Investigation for Large Undercooling. International
Journal of Rapid Solidification, vol. 6, No. 3-4, pp. 297-324.
Wang G. and E.F. Matthys. 1991. Modelling of heat transfer and solidification
during splat cooling: effect of the splat thickness and splat / substrate
thermal contact. International Journal of Rapid Solidification, vol. 6,
No. 2, pp. 141-174.
Wang G. and E.F. Matthys. 1991. Modelling of Rapid Solidification by Melt-spinning:
Effect of Heat Transfer in the Cooling Substrate. Materials Science and
Engineering, vol. A136, pp. 85-97.
Gong Z., P. Wilde, and E.F. Matthys. 1991. Numerical Modelling of the Planar
Flow Melt-Spinning Process, and Experimental Investigation of the solidification
puddle dynamics. International Journal of Rapid Solidification, vol. 6,
No. 1, pp. 1-28.
Gong Z., P. Wilde, and E.F. Matthys. 1990. Planar Flow Casting : Fluid
Flow, Heat Transfer, and Solidification Puddle Dynamics. In Intelligent
Processing of Materials, (Eds: H. Wadley and W.E. Eckhart), pp. 149-161.
Warrendale, PA: TMS Pub.
Wang G.X. and E.F. Matthys. 1991. Two-dimensional modelling of planar
flow melt-pinning. Report No. UCSB-ME-91-2 (27 p.), College of Engineering,
University of California, Santa Barbara.
Valencia J.J., E.F. Matthys, G. Trapaga, and J. Szekely. 1990. The impingement
of molten metal drops on a substrate: comparison of experimental and numerical
modelling results. Report No. UCSB-ME-90-12 (37 p.), College of Engineering,
University of California, Santa Barbara.
Wang G. and E.F. Matthys. 1990. Modeling of planar flow casting and splat
cooling: effect of process parameters on solidification characteristics.
Report No. UCSB-ME-90-11 (38 p.), College of Engineering, University of
California, Santa Barbara.
Wilde P.D. and E.F. Matthys. 1990. "An experimental investigation
of planar flow melt-spinning: puddle and ribbon dynamics." Report
No. UCSB-ME-90-7 (146 p.), College of Engineering, University of California,
Santa Barbara.
Wang G., Z. Gong, P. Wilde, and E.F. Matthys. 1990. "Modelling of
Planar Flow Casting and Splat cooling: Temperature Profiles, Interface
velocities, and cooling rates." Report No. UCSB-ME-90-3 (51
Eskenazi M.I., P. Wilde, and E.F. Matthys. 1989. "Planar Flow Casting:
Flow Visualization and Numerical Modeling." Report No. UCSB-ME-89-2
(50 p.), College of Engineering, University of California, Santa Barbara.
Matthys E.F., M. Eskenazi, P. Lermant, and P. Wilde. 1988. "Heat transfer
and fluid dynamics during solidification: planar flow casting and levitation
melting." Report No. UCSB-ME-88-5 (39 p.), College of Engineering,
University of California, Santa Barbara.
Eskenazi M.I. and E.F. Matthys. 1988. "Modelling of planar flow melt
spinning using the boundary layer equations." Report No. UCSB-ME-88-4
(87 p.), College of Engineering, University of California, Santa Barbara.
(Please note that abstracts for several papers published since mid-95 will
be added shortly. Thank you for your patience.)
Wang G.-X. and E.F. Matthys. 1995
To appear in Transport Phenomena in Manufacturing and Materials Processing (Proceedings of the 1995 ICME), ASME Pub, Washington D.C.
Abstract
A one-dimensional model including non-equilibrium phenomena was developed
for surface melting and resolidification of both pure metals and binary
alloys substrates. Non- equilibrium kinetics from crystal growth theory
are introduced in the model to treat both non- equilibrium melting and
resolidification. The modelled problem involves a moving boundary with
both heat and solute diffusions and is solved by an implicit control volume
integral method with solid / liquid interface immobilization by coordinate
transformation. For illustration of the model applicability, we have analyzed
laser surface melting of pure metals (Al, Cu, Ni, Ti) and dilute Al-Cu
alloys, and some typical results are presented. The computation results
show large solid overheating and melt undercooling which result from the
high heat flux and the slow kinetics. The melt undercooling is maintained
during most of the resolidification process and so is the high solidification
rate. Complex interface velocity variations during the earlier stages of
resolidification were obtained and result from interactions between various
physical mechanisms. A strong effect of the solute on the interface velocity
was also predicted.
Wang G.-X. and E.F. Matthys, 1995
To appear in Transport Phenomena in Net-Shape Manufacturing (Proceedings of the 1995 National Heat Transfer Conference), ASME Pub.
Abstract
Experiments have been conducted to quantify the interfacial heat transfer
between molten copper and a cold metallic substrate, and in particular
to investigate the heat transfer variation as the initial liquid / solid
contact becomes a solid / solid contact after nucleation. A high heat transfer
coefficient (ranging from 104 to 105 W/m2K) during the earlier liquid cooling
phase and a lower heat transfer coefficient (from 103 to 104 W/m2K) during
the subsequent solid splat cooling phase were estimated through matching
of model calculations and the measured temperature history of the sample.
The dynamic variations in the interfacial heat transfer resulting from
the solidification process were quantified for splat cooling and were found
to be affected by the melt superheat, the substrate material, and the substrate
surface finish.
Liu W., G.-X. Wang, and E.F. Matthys. 1995.
Int. J. Heat Mass Transfer, Vol. 38, No. 8, pp. 1387-1395.
Abstract
The behavior of a molten metal droplet impinging, spreading and solidifying
on a solid substrate is relevant to many processes such as splat cooling
and spray deposition. In this study, we have conducted experiments aiming
at the study of the cooling and solidification of a molten metal droplet
after impact. Temperature measurements were conducted during and after
solidification. Some results are presented to illustrate the effect of
superheat and substrate material on cooling rate. We have also estimated
the thermal contact coefficient between splat and substrate by matching
for a number of conditions the experimental data to predictions of a heat
transfer and phase change model. The results suggest that this coefficient
can decrease during solidification by an order of magnitude during solidification
for the case of a splat on metal substrates. For splats on quartz where
there is good bonding, the thermal contact coefficient appears to stay
the same before and after solidification.
Wang, G.X. and E.F. Matthys. 1995.
In Proceedings of the 1995 NSF Design and Manufacturing Conference, pp. 451-452, SME Pub., Dearbon MI.
Liu W., G.-X. Wang, E.F. Matthys. 1994.
In Thermal Processing of Materials, Vol. HTD-289, pp. 21-29, ASME, New York.
Abstract
The manufacture of metal matrix composite materials by spray deposition
is a very attractive process, but impaired by the spallation that may take
place after impact of molten metal droplets on the fibers. In this work,
the spallation of a quartz substrate was investigated through video and
acoustic measurements, and through temperature measurements of the splat
surface. The time scales pertaining to the fracture mechanisms are examined
from acoustic measurements of the spallation. The spall formation mechanism
was quantified by analyzing the geometric configuration of the splats and
spalls under varying conditions of droplet superheat, droplet size, and
droplet or substrate material. Furthermore, the thermal contact resistance
between the splat and the substrate was evaluated by matching the measured
temperatures of the top or bottom surface of the splat with numerical results
from a heat conduction model with phase change.
Wang G.-X. and E.F. Matthys. 1994.
In Heat Transfer 1994, (Proceedings of the 10th international heat transfer conference), IChemE Pub., Rugby, UK. Vol. 4, pp. 169-174.
Abstract
In processes such as strip casting, a thin layer of molten metal is
brought in contact with a colder substrate. The metal/substrate interface
heat transfer may then determine the melt cooling rate and solidification
velocity, and therefore affects strongly the material properties of the
solidified product. As a first step in the systematic study of the interface
heat transfer phenomena in those processes, we have performed experiments
to quantify the interface heat transfer coefficient when molten metal is
solidified on a substrate. The temperature of the solidifying metal is
measured at various locations, and an inverse heat transfer model is then
used to estimate the variation in interface heat transfer coefficient as
a function of time. This coefficient is calculated for a range of superheats
and two substrate materials. It is found that large variations in heat
transfer coefficient take place before and around nucleation time, but
that this coefficient remains about constant starting shortly thereafter.
Wang G.-X. and E.F. Matthys. 1993.
In Heat and Mass Transfer in Materials Processing and Manufacturing, Vol. HTD-261, pp. 35-44, ASME, New York.
Abstract
Many manufacturing systems involving fast-moving substrates or material
to be processed are intended to achieve conditions that would result in
rapid solidification with undercooling. A general one-dimensional model
for planar solidification of binary alloys and which includes non-equilibrium
solidification with melt undercooling has been developed to investigate
these processes. Solidification kinetics relationships for binary alloys
are introduced to supplement the heat and solute diffusion equations in
order to provide a more complete description of this moving boundary problem.
We use an implicit finite difference method with solid/liquid interface
immobilization by coordinate transformation. An efficient iteration scheme
was developed to calculate the varying temperature and solute concentrations
at the moving solid/liquid interface. As an example, splat cooling of a
dilute binary nickel alloy is analyzed and some typical results are presented.
Liu W., G.-X. Wang, and E.F. Matthys. 1992.
In Transport Phenomena in Materials Processing and Manufacturing, vol. HTD-196, pp. 111-118, ASME, New York.
Abstract
The behavior of a molten metal droplet impinging, spreading and solidifying
on a solid substrate is relevant to many processes such as splat cooling
and spray deposition. In this work, we have conducted experiments aiming
at the study of the cooling and solidification of a molten metal droplet
after impact. Measurements of temperature and of acoustic emissions, together
with high-speed visualization were conducted during and after spreading.
Some results are presented to illustrate the effect of superheat and substrate
material on cooling rate. We have also evaluated the value of the thermal
contact coefficient by matching the experimental data to predictions of
a heat transfer and phase change model. The results suggest that the value
of the heat transfer coefficient decreases during solidification by up
to an order of magnitude for the case of a splat on metal substrates. For
splats on quartz or glass where there is good bonding, the thermal contact
coefficient appears to stay constant throughout the process.
Wang G.-X. and E.F. Matthys. 1992.
In Melt-Spinning and Strip Casting, pp. 263-282, Warrendale, PA: TMS Pub.
Abstract
This paper describes a two-dimensional model of fluid flow and heat
transfer with phase change for the planar flow melt-spinning process. Boundary
layer theory is used to model fluid flow and heat transfer in the solidification
puddle, and a semi-implicit finite difference scheme is used to solve the
corresponding governing equations. In order to take into account non-equilibrium
solidification with melt undercooling, a growth kinetics relationship between
the solidification interface velocity and the interface undercooling is
incorporated in the model. The location of the interface and its temperature
are calculated using an interface tracking technique based on control volume
integrals with element subdivision. Besides the interface velocity and
temperature, and melt cooling (or heating) rate, the model predicts also
the shape of the downstream meniscus formed between the crucible and the
moving wheel. Some results for the planar flow melt- spinning of an aluminum
melt with undercooling are presented, including predictions of the streamlines
and isotherms in the puddle. The effect of the interface kinetics and melt
undercooling on the solidification characteristics is quantified through
a comparison with an equilibrium solidification model. The results show
the effect of recalescence on the solidification of the ribbon, and in
particular allow us to quantify the fraction of the ribbon affected by
this recalescence. In this lower region, a much higher interface velocity
is predicted than in the upper part of the ribbon which is solidified under
quasi- equilibrium conditions.
Matthys E.F. 1992.
In Proceedings of the 1992 NSF Design and Manufacturing Systems Conference, Atlanta, January 8-10; Pub: Society of Manufacturing Engineers, Dearborn; pp. 135-138.
Trapaga G., E.F. Matthys, J. Valencia, and J. Szekely. 1992.
Metallurgical Transactions, vol. 23B, No. 6, pp. 701-718.
Wang G.-X. and E.F. Matthys. 1992.
In Advanced Sensing, Modelling, and Control of Materials Processing; pp. 231-252. Warrendale, PA: TMS Pub.
Abstract
A two-dimensional boundary-layer fluid flow and heat transfer model
has been used to analyze solidification during the planar flow melt-spinning
process. An interface-tracking technique is also implemented in this model
to predict the solid/liquid interface motion and therefore to calculate
more accurately its velocity and the melt cooling rate at that location.
Heat conduction in the chill wheel has also been taken into account. The
influence of the fluid flow in the puddle on the solidification behavior
during planar flow melt-spinning has been quantified by comparing the results
of this two-dimensional boundary-layer model with two simpler one-dimensional
heat conduction models. It is seen that these one-dimensional models either
overestimated or underestimated the interface velocity when compared with
the two-dimensional boundary model. This two- dimensional model also predicts
a sharp increase in solidification rate after detachment of the fluid from
the crucible.
Wilde P. and E.F. Matthys. 1992.
Materials Science and Engineering, vol. 150, No. 2, pp. 237-247.
Abstract
Planar Flow Casting (PFC) is one of the most promising processes for
the manufacture of thin metal sheets and high-performance rapidly-solidified
alloys, but very little experimental information is available about this
process. We have therefore developed an experimental installation that
enables us to study the dynamic behavior of the PFC solidification puddle.
We have in particular used high-speed video recordings to analyze casting
runs conducted for various values of the most important parameters. The
size and shape of the puddle have been quantified, and the effect of variations
in flow rate, gap, and wheel speed on the puddle shape has been studied.
We have also investigated the dynamics of the development of the puddle
immediately after melt ejection. Both digitized results and high-speed
photographic sequences of solidification puddles are shown and discussed
in this article.
Wang G. and E.F. Matthys. 1992.
Accepted for publication in Heat and Mass Transfer in Manufacturing Technologies. Washington, DC: Hemisphere Pub. (Printing cancelled.)
Wang G.-X. and E.F. Matthys. 1992.
International Journal of Heat and Mass Transfer, 35, No. 1, pp. 141-153.
Abstract
An effective interface-tracking scheme has been developed for the numerical
modelling of heat transfer and phase change during rapid solidification.
This technique is based on Control Volume Integrals, and achieves high-resolution
tracking of the solid / liquid interface by element subdivision. It is
particularly well-suited for rapid solidification with undercooling, for
which the accurate prediction of the interface temperature during recalescence
is very important. This approach has been used to model the Planar Flow
Casting and Splat Cooling processes. Some results on temperature profiles
and on interface velocity, location, undercooling, and cooling rate are
shown for both processes.
Wang G.-X. and E.F. Matthys. 1992.
In Advanced Sensing, Modelling, and Control of Materials Processing; pp. 59-80. Warrendale, PA: TMS Pub.
Abstract
A non-equilibrium numerical model has been developed to study the heat
transfer and phase change during splat cooling with undercooling. This
model allows the interface temperature to vary during solidification, and
a kinetics relationship is introduced to enable us to calculate this temperature
as well as the interface velocity. We are presenting some results that
illustrate the difference in results predicted by an equilibrium model
and by linear and exponential undercooling models. Some results on interface
velocity and temperature are shown for various nucleation temperatures
and for various external heat transfer coefficients. It is seen that these
parameters affect considerably the solidification characteristics, in particular
the variation of interface velocity through the splat and the size of the
recalescence region. Interestingly, it is shown that a lower external heat
transfer may result indirectly in a higher interface velocity during recalescence,
all other parameters being equal.
Wang G.-X. and E.F. Matthys. 1991.
International Journal of Rapid Solidification, vol. 6, No. 3-4, pp. 297-324.
Abstract
A parametric investigation of the heat transfer and phase change during
splat cooling has been conducted with a non-equilibrium numerical model.
This model is able to track the solid / liquid interface motion for rapid
solidification with large undercooling. Some results are shown to illustrate
the level of uncertainty introduced by the use of linearized kinetics models.
The influence of various parameters (such as nucleation temperature, splat
/ substrate thermal contact, melt and substrate materials, kinetics coefficients,
initial substrate temperature, and initial melt temperature) on the solidification
interface temperature and velocity has also been investigated. The related
physical mechanisms are discussed in terms of heat transfers and temperature
distributions. One important effect quantified in this study is the fact
that both the interface velocity during recalescence and the fraction of
the splat affected by recalescence depend not only on the nucleation temperature
but also (and very strongly) on the undercooling distribution across the
splat upon nucleation. For instance, a relatively high nucleation temperature
with small temperature gradients in the splat may well result in a higher
solidification rate over a larger fraction of the splat than a very low
nucleation temperature with large temperature gradients in the splat. Interestingly
(and somewhat counterintuitively) one might then achieve higher solidification
rates in the splat for poor thermal contact between the splat and the substrate
than for good thermal contact, all other parameters (including nucleation
temperature) being equal.
Wang G.-X. and E.F. Matthys. 1991.
International Journal of Rapid Solidification, vol. 6, No. 2, pp. 141-174.
Abstract We have developed an improved Control Volume Integral method for the numerical modelling of rapid solidification processes. This technique provides high-resolution tracking of the solidification interface with and without undercooling. We have conducted a study of the splat cooling process and of the effect of various parameters on the local interface velocity, cooling rate, and temperature in the splats. In particular, the effect of the heat transfer coefficient at the splat / substrate interface and of the splat thickness on the solidification characteristics has been investigated over a range of conditions. Among other observations, the region over which recalescence takes place has been quantified, with the recalesced splat fraction found to be proportionally much larger for a thin splat than for a thick splat. Rather sharp differences are seen to exist between this domain and the rest of the splat in terms of interface velocity, cooling rate, and temperature. The comparison of results with and without undercooling indicates that large errors in interface velocity and cooling rate in the bottom part of the splat would result from the use of models that do not take into account the undercooling phenomenon.
Wang G.-X. and E.F. Matthys. 1991.
Materials Science and Engineering, vol. A136, pp. 85-97.
Abstract
An improved Control Volume Integral method has been developed for the
numerical modelling of heat transfer during the melt-spinning process.
The heat transfers both inside the melt and in the substrate are incorporated
directly in the numerical models. Several parametric studies have been
conducted to investigate the effect of the heat transfer in the wheel,
of the wheel material, of the melt material, and of the superheat level
on the solidification characteristics, and in particular on the interface
velocity and on the cooling rate at the interface. The calculations show
also that the local substrate surface temperature may increase under the
solidification puddle by several hundred Kelvins, even for a copper wheel,
and this surface temperature increase is found to have a significant impact
on the solidification process. We believe that it is essential to include
the surface heating factor in numerical models of melt-spinning and other
rapid solidification processes relying on direct contact with a solid substrate.
Gong Z., P. Wilde, and E.F. Matthys. 1991.
International Journal of Rapid Solidification, vol. 6, No. 1, pp. 1-28.
Abstract
A numerical model based on two-dimensional boundary layer equations
has been developed for the Planar Flow Melt-Spinning process. The coupled
continuity, momentum, energy, and phase change equations are solved simultaneously.
The velocity and temperature distributions in the puddle and ribbon, the
cooling rate at any location, and the shape and location of both the solid
/ liquid interface and the downstream meniscus can then all be evaluated
numerically. Parametric studies have been conducted, and some examples
of isotherm and streamline maps are shown for several values of the main
process parameters. We have also conducted an experimental investigation
of the dynamics of the solidification puddle by high- speed video recordings,
and some results such as photographs of high-frequency surface waves and
of the establishment of a typical solidification puddle are shown. The
experimental results were used to obtain estimates of the thermal contact
resistance at the substrate by matching the measured detachment point and
meniscus shape with numerical modelling results.
[E.F. Matthys' homepage] [Mechanical Engineering Dept] [College of Engineering] [UCSB] [UCSB Web Sites]
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Last Modified : Nov. 14, 1996 by E.F. Matthys