Facilities

MEMS Fabrication Facility

Mechanical and Environmental Engineering
University of California, Santa Barbara
Santa Barbara, CA 93106

UCSB Nanofab

Electrical and Computer Engineering
University of California, Santa Barbara
Santa Barbara, CA 93106
Equipment List Equipment List
   

Dry Etch:
Applied Materials Centura Etching System
Programmable Loadlocked 3-Chamber Etcher

Chamber #1: Fluorine-Based oxide etch
Chamber #2: Si-deep etch
Chamber #3: HART process (bromine based etch)

   Dry Etch:
RIE #1 Custom, Loadlocked Chlorine-Based System
RIE #2 Methane / Hydrogen-Based System
RIE #3 Fluorine-Based System MRC 51
RIE #5 Loadlocked Chlorine-Based System
SiRIE ICP Flourine Etcher for MEMS Processes
Panasonic E640 multi-chamber ICP
     
Silicon Oxidation:
Tystar 8" Oxidation Furnace
2 tube		   E-Beam Lithography:
JEOL JBX-5D11(U) Electron Beam Lithography System
     
Wet Benches/Cleaning Stations:
Programmable, automated benches
Heated wafer cleaning tanks (up to 8")
RCA/pirhana clean
8/6/4" spin cleaner/dryer		   Photolithography:
Deep UV Flood Exposer / Light source and HA-1KC2 power supply
Mask Aligner / MJB 3 UV400 IR
Mask Aligner / MJB 3 UV400
GCA 6300 I-Line Wafer Stepper
265 nm Holography System for Gratings
     
Drying oven
Convection oven used for low temperature annealing and dehydration		   Packaging:
M-8A Flip Chip Aligner Bonder
     
Wafer Bonder
Karl Suss MB6		   Annealing:
RTA (Rapid Thermal Annealer), AET
Strip Annealer
     
Test and Inspection:
Optical Microscopes
Cascade Microtech Probe Station
Custom Polytec PI Laser Vibrometer System
IR wafer bonding inspection setup
Wyko NT 1100 white light interferometer		   Test and Inspection:
Hitachi Scanning Electron Microscope (SEM)
Optical Microscopes
Rudolph Ellipsometer
Filmetrics White Light Reflectometer
Dektak II Profilometer
Digital Instruments AFM
Probe Station with Curve Tracer
     
  Vacuum Deposition:
Four Pocket Electron Beam Evaporator
Solder Evaporator, Veeco VE-300
Three-Target DC/RF Sputtering System
NRC 3117 Three Source Thermal Evaporator
E-Beam #3 Load Locked Metal Evaporator Dual Gun
E-Beam #4 CHA Muti-Wafer Evaporator
PECVD Plasma Therm 790 for Oxides and Nitrides
Sputtered Films Endeavor 3-Module Sputtering System
     
     
Contact Information: Dave Bothman   Contact Information: Jack Whaley
Phone: (805) 893-4125   Phone: (805) 893-8174
Fax: (805) 893-5341   Fax: (805) 893-8170
Email: bothman@engineering.ucsb.edu   Email: nanotech@ece.ucsb.edu